Project title: MULTI CHIP MODULES

Company name : *** MICRO COMPONENTS AND SYSTEMS LTD.

LTD.

TECHNOLOGICAL FIELD
Microelectronics

KEY WORDS
BGA, MCM, Multi Chip Modules,
Electronic Packaging, Substrates

PROJECT SUMMARY
ALOX - a proprietary technology for manufacturing MCM - D type
structures based on an innovative anodic oxidation process of
aluminum has been developed. This technology can be applied for
high density interconnect Multi Chip Modules, BGA modules and for
high power and temperature applications.
The market for such applications is expanding rapidly as the
needs for the miniaturization of electronic systems grow.

ENTREPRENEURS
Dr. Uri Mirsky - Experienced manager
in the field of microelectronics.
Mr. Shimon Neftin - Experienced technologist
in microelectronics.

PROJECT STATUS
The company left the incubator in October 1995.
Patents issued and pending. .
An investment of US $400,000 has been raised. A second stage
development project supported by the Chief Scientist has been
approved and completed.
The company is a partner in the Consortium of Electronic
Packaging.
Prototype circuits applying the ALOX technology have been
produced.

REQUIRED INVESTMENT: US $1.8M for completion of development,
beta-site testing and setting a pilot plant.

COOPERATION REQUIRED
Strategic partners; joint ventures to develop applications.

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POB 470 MIGDAL HAEMEK 23000 ISRAEL; TEL/FAX: 972-4-6442666;
E-MAIL: mcs1@infolink.net.il

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